Modelling fracture propagation and failure in a rock pillar under mechanical and thermal loadings

Crack propagation and fracture in silicon wafers under thermal stress

The behaviour of microcracks in silicon during thermal annealing has been studied using in situ X-ray diffraction imaging. Initial cracks are produced with an indenter at the edge of a conventional Si wafer, which was heated under temperature gradients to produce thermal stress. At temperatures where Si is still in the brittle regime, the strain may accumulate if a microcrack is pinned. If a cr...

Failure Mechanisms Investigation in Thermal Barrier Coatings under Isothermal and Non-sothermal Fatigue Loadings using Design of Experiments

In this article, failure and fracture mechanisms in an aluminum alloy (which has been used in diesel internal combustion engines), with and without ceramic thermal barrier coatings, have been investigated under isothermal and non-isothermal fatigue loadings. In this research, the base material is an aluminum-silicon-magnesium alloy and the thermal barrier coating includes a metallic bond coat l...

A path-independent integral for fracture of solids under combined electrochemical and mechanical loadings

In this study, we first demonstrate that the J-integral in classical linear elasticity becomes path-dependent when the solid is subjected to combined electrical, chemical and mechanical loadings. We then construct an electro-chemo-mechanical J-integral that is path-independent under such combined multiple driving forces. Further, we show that this electro-chemo-mechanical J-integral represents ...

Rock Mass Response to Coupled Mechanical Thermal Loading Äspö Pillar Stability Experiment, Sweden

Reliability of Lead-Free Interconnections under Consecutive Thermal and Mechanical Loadings

To simulate more realistically the effects of strains and stresses on the reliability of portable electronic products, lead-free test assemblies were thermally cycled (−45°C/+125°C, 15-min. dwell time, 750 cycles) or isothermally annealed (125°C, 500 h) before the standard drop test. The average number of drops to failure increased when the thermal cycling was performed before the drop test (1,...